[Breakthrough 600mm/s Ultra-Fast Printing]
Unleash unprecedented speed without compromising quality! SUNLU High Speed PLA+ 2.0 revolutionizes rapid prototyping and production, supporting blazing speeds of up to 600mm/s at 230–260°C. Engineered with advanced flow dynamics, it maintains flawless layer adhesion and surface finish even at extreme velocities—perfect for high-efficiency makers and industrial workflows.
[Unbeatable Toughness & Impact Resistance]
Upgraded for rugged durability, HyperSpeed PLA+ 2.0 delivers 10x the strength of standard PLA, with enhanced flexibility to resist cracks, drops, and impacts. Ideal for functional parts, tools, or outdoor gear that demands both speed and resilience.
[Smooth Flow, Zero Clogs – Print Faster, Cleaner]
Optimized viscosity ensures bubble-free, jam-resistant extrusion at any speed. From intricate details at 50mm/s to lightning-fast 600mm/s builds, enjoy consistent flow, minimal stringing, and crisp dimensional accuracy (±0.02mm).
[Wide Compatibility & Hassle-Free Winding]
Featuring SUNLU’s proprietary 100% Neatly Wound Spool Technology, this tangle-free filament fits almost all 1.75mm FDM printers. Spool dimensions (8" diameter, 2.5" width, 2.2" hub) allow easy mounting, while its low-warp formula works flawlessly with or without enclosures.
[Smart Settings for Speed & Precision]
Maximize performance with recommended temps:
Nozzle: 200–260°C (speed-optimized tiers:
200–215°C: 50–150mm/s
215–230°C: 150–300mm/s
230–260°C: 300–600mm/s)
Bed: 55–65°C (no adhesive needed).